Nanotechnology

  • 1 Lithography

    » Mask Alignment Systems
    » Resist Processing Systems
    » Lithography Track Systems
    » Nanoimprint Litografi Systems
    » Inspection Systems
  • 2



    Metrology

    » Mechanical Profiler

    » Optical Profiler
  • 3 Bonding

    » Wafer Bonding Systems
    » Bond Alignment Systems
    » Integrated Bonding Systems
    » SOI Bonding Systems
    » Temporary Bonding and Debonding Systems
    » Inspection Systems
  • 4



    Diamound Coating (HF-CVD)

    » Microwave Plasma CVD

    » Hot Filament CVD

Metrology

• Mechanical Profilers
• Optical Profilers

Lithography

• Mask Alignment Systems
• Resist Processing Systems
• Lithography Track Systems
• Nanoimprint Lithography Systems(UV- NIL, µCP, HE)
• Inspection Systems

Bonding

• Wafer Bonding Systems
• Bond Alignment Systems
• Integrated Bonding Systems
• SOI Bonding Systems
• Temporary Bonding and Debonding Systems
• Inspection Systems

Diamound Coating (HF CVD)

• Microwave Plasma CVD
• Hot Filament CVD

Crystal Growing Systems

• Pulling Mono Ingots
• Growing Multi Ingots